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Will An Adhesion Promoter Prevent Delamination In Power Semiconductor Packages?

As more semiconductor packages are used in automotive applications; it is increasingly important the package has zero delamination.

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Power semiconductor packages are used in high temperature, high voltage environments. With the increase of electric vehicles (EVs) and hybrid electric vehicles (HEV) in the automotive market, demands on (and for) power packages have been growing. Packages for automotive applications must pass extensive testing for safety, therefore, packaging reliability is essential. As more semiconductor packages are used in automotive applications; it is increasingly important the package has zero delamination.

By Sophie Olson, Sr. Manager, Wirebond and Power Package Development, Amkor Technology, Inc.

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