category: Test, Measurement and Analytics

category: Auto, Security & Edge AI

Accurate Error Bit Mode Analysis Of STT-MRAM Chip With A Novel Current Measurement Module
By Advantest - 11 Jun, 2019 - Comments: 0

Authors: (Advantest) Ryo Tamura, Ibuki Mori Naoyoshi Watanabe; (Tohoku University) Hiroki Koike, Tetsuo Endoh. A novel memory test system is needed for future STT-MRAM mass production that supports error bit analysis and its mode categorization on STT-MRAM chip measurement, as STTMRAM cell’s switching is a probabilistic phenomenon based on quantum mechanics. In order to meet this requireme... » read more

Smart Plug-And-Play DFT For Arm Cores
By Ron Press - 11 Jun, 2019 - Comments: 0

Modern SoCs are experiencing continued growth in capabilities and design sizes with more and more subsystem IPs being implemented. These large, complex, multi-core SoCs need strategies for DFT and ATPG that effectively reduce DFT effort, minimize ATPG runtime, and still achieve the target test coverage. Hierarchical DFT enables designing and testing of these designs in a systematic and repeatab... » read more

Why Choose NI For PMUs And Wide Area Monitoring
By NI - 11 Jun, 2019 - Comments: 0

PMUs have helped foster high speed data gathering from the grid with some utilities capturing phasor data as fast as 1 sample per cycle. As adoption and experience with PMU data grows, new possibilities emerge to help better monitor and control the dynamic health of a utility grid. PMUs built on NI technology have several advantageous features that can help utilities, power systems engineers, a... » read more

Failure Analysis Of Electronic Devices Using Scanning Acoustic Microscopy
By Yavuz Kose - 11 Jun, 2019 - Comments: 0

Scanning acoustic microscopy, or SAM, is a non-destructive technique used in failure analysis of complex devices. SAM can provide a resolution down to sub-micron thicknesses. SAM is an efficient tool for analysis of adhesion between layers and presence of possible flaws in each layer. This can be used e.g. for investigations of sealing, coating, flip-chip underfills, BGA, QFN, wafer to wafer ... » read more

Using ML For Post-Silicon Validation
By Ed Sperling - 11 Jun, 2019 - Comments: 0

Ira Leventhal, vice president of Advantest’s new concept product initiative, talks about how to use machine learning to ferret out hidden relationships in a complex design and to utilize that data to improve chips. » read more

5G Drives New Test Approaches
By Kevin Fogarty - 11 Jun, 2019 - Comments: 0

Test/validation providers are claiming steady progress in the race to deliver 5G network components that support millimeter-wave as well as lower-frequency networks. Going from a state of no existing off-the-shelf test equipment suitable for 5G standalone new radio (NR), test companies are introducing equipment that can handle mmWave component testing on a limited scale. 5G is a next-generat... » read more

Clean Focus, Dose And CD Metrology For CD Uniformity Improvement
By KLA - 11 Jun, 2019 - Comments: 0

Authors: Honggoo Leea, Sangjun Hana, Minhyung Honga, Seungyong Kima, Jieun Leea, DongYoung Leea, Eungryong Oha, Ahlin Choia, Nakyoon Kimb, John C. Robinsonc, Markus Mengelc, Pablo Rovirac, Sungchul Yooc, Raphael Getinc, Dongsub Choib, Sanghuck Jeonb aSK Hynix, 2091, Gyeongchung-daero, Bubal-eub, Icheon-si, Gyeonggi-do, 467-701, Korea bKLA-Tencor Korea, Starplaza bldg., 53 Metapolis-ro, Hwasung... » read more

Hacking SoC IP Under Pressure
By SE Staff - 11 Jun, 2019 - Comments: 0

Hack@DAC certainly shows that some teams can find bugs faster than others. The hackfest, now in its third year, is a bug-finding contest for teams of university students joined by a smattering of industry members whose task is to find a bugs implanted in SoC IP.  The teams follow the practices of real-world security teams. “[The teams'] objective is to identify the security vulnerabilitie... » read more

ATE Lab To Fab
By Ed Sperling - 05 Jun, 2019 - Comments: 2

Shu Li, business development manager at Advantest, zeroes in on the communication gap between engineers on the design side and the manufacturing/test side, why it exists, and what needs to be done to bridge that gap in order to speed up and improve test quality. https://youtu.be/Nd-5_twbJBw     See other tech talk videos here » read more

Here Come The Economists
By Ed Sperling - 07 May, 2019 - Comments: 0

Big data is undergoing some big changes. For years, the challenge was getting enough good data to create models for everything from Wall Street trends to traffic routing. But with an influx of data from billions of sensors and electronic transactions, data is no longer in short supply. In fact, there is so much data pouring in that companies need to figure out what to do with it. That requi... » read more

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