category: Test, Measurement and Analytics

category: Auto, Security & Edge AI

The Emergence Of Inline Screening For High Volume Manufacturing
By KLA - 08 Jun, 2021 - Comments: 0

The semiconductor content of automobiles is growing rapidly in applications where quality is of paramount importance, and automotive manufacturers have taken the lead in driving a “Zero Defect” mentality into their supply chain. The motivation behind this paper started with engagements with semiconductor suppliers as well as automotive manufacturers, where KLA witnessed many clear examples ... » read more

Hybrid System-Level Test For RF SiP
By Koji Miyauchi - 08 Jun, 2021 - Comments: 0

In recent years, the proliferation of the IoT has focused attention on low-power-wireless applications. IoT modules incorporating functions such as Bluetooth Low Energy (BLE) transceivers, MCUs, and power-management circuitry are becoming system-in-package (SiP) and even one-chip devices. Such devices increase the demand for a mass-production test environment that can measure them in a short ti... » read more

Characterization Of CMP Processes With White Light Interferometry
By Bruker - 08 Jun, 2021 - Comments: 0

Faster computer and electronic processors require smaller features for integrated circuits (IC), which in turn require smaller and smoother substrate surfaces. Chemical mechanical polishing (CMP) has become one of the most critical semiconductor fabrication technologies because it offers a superior means of removing unwanted topography in interlevel dielectric layers and achieving sufficient pl... » read more

In-field, In-Mission Reliability Monitoring Based On Deep Data
By proteanTecs - 08 Jun, 2021 - Comments: 0

This paper describes a Deep Data approach to reliability monitoring in advanced electronics, based on degradation as a precursor for failure. By applying machine learning algorithms and analytics to data created by on-chip monitoring IPs (Agents), IC/system health and performance can be continuously monitored, at all stages of the product lifecycle. Realtime degradation analysis of critical par... » read more

The Next Generation of Testbench Debug Productivity
By Synopsys - 08 Jun, 2021 - Comments: 0

It is widely accepted that verification consumes at least sixty percent of time and resources on most semiconductor development projects. This statistic has been borne out by many industry surveys over the last twenty years. Verification technology has had to evolve to accommodate ever larger and more complex designs. Innovations such as constrained-random simulation and the Universal Verificat... » read more

Monitoring Performance From Inside A Chip
By Ed Sperling - 01 Jun, 2021 - Comments: 0

Deep data, which is generated inside the chip rather than externally, is becoming more critical at each new process node and in advanced packages. Uzi Baruch, chief strategy officer at proteanTecs, talks with Semiconductor Engineering about using that data to identify potential problems before they result in failures in the field, and why it's essential to monitor these devices throughout their... » read more

Managing Wafer Retest
By Anne Meixner - 19 May, 2021 - Comments: 1

Every wafer test touch-down requires a balance between a good electrical contact and preventing damage to the wafer and probe card. Done wrong, it can ruin a wafer and the customized probe card and result in poor yield, as well as failures in the field. Achieving this balance requires good wafer probing process procedures as well as monitoring of the resulting process parameters, much of it ... » read more

Recalculating The Cost Of Test
By Ed Sperling - 11 May, 2021 - Comments: 0

The cost of test is rising. For decades, test was limited to a flat 2% of the cost of designing and manufacturing a chip. Today, no one is quite sure what that cost really is, and there doesn't seem to be any single formula for determining it. In some cases, there isn't even a sense of urgency to finding out. Several significant changes are occurring that make any formula difficult to cal... » read more

Understanding Optical Inspection For CIS
By Woo Young Han - 11 May, 2021 - Comments: 0

The demand for smartphone cameras, video conferencing, surveillance and autonomous driving has fueled explosive growth of CMOS image sensor (CIS) manufacturing in the last decade. While CIS becomes an increasingly important element in the production of today’s consumer electronics, there are unique challenges in production that must be addressed. As pixel sizes shrink, we see an inverse relat... » read more

In-Chip Sensing And PVT Monitoring: Not Just An Insurance Policy
By Ramsay Allen - 11 May, 2021 - Comments: 0

You wouldn’t drive an expensive car without insurance or take a flight in an aircraft without performing instrument and control surface checks. So why would you take the risk of designing a multi-million dollar advanced node semiconductor device without making sure you are aware of, and able to manage, the dynamic conditions that had the potential to make or break a silicon product? Advanced... » read more

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