category: Test, Measurement and Analytics

category: Auto, Security & Edge AI

Sharing Secure Chip Data For Analytics
By Anne Meixner - 06 Apr, 2021 - Comments: 0

New approaches and standards are being developed to securely share manufacturing and test data across the supply chain, moves that have long been considered critical to the reliability of end devices and faster time to yield and profitability. It will take time before these methods become widespread in the IC supply chain. But there is increasing agreement these kinds of measures are essenti... » read more

How Do Machines Learn?
By Weiyang (Will) Zhou - 06 Apr, 2021 - Comments: 0

We depend, or hope to depend, on machines, especially computers, to do many things, from organizing our photos to parking our cars. Machines are becoming less and less "mechanical" and more and more "intelligent." Machine learning has become a familiar phrase to many people in advanced manufacturing. The next natural question people may ask is: How do machines learn? Recognizing diverse obje... » read more

Monitoring Chips On Many Levels
By Bryon Moyer - 06 Apr, 2021 - Comments: 1

Monitoring is an important trend for optimizing yield, performance, and uptime in systems that use complex integrated circuits, but not all monitoring is the same. In fact, there are multiple levels of monitors. In many cases, they can be used together to help solve problems when something is amiss. They also can be used to help identify who in the supply chain owns the fix. “If the sys... » read more

Security For Cars That Are Smartphones On Wheels
By Taylor Amerding - 06 Apr, 2021 - Comments: 1

Your modern car is a computer on wheels—potentially hundreds of computers on a set of wheels. Heck, even the wheels are infested with computers—what do you think prompts that little light on your dashboard to come on if your tire pressure is low? And computers don’t just run your infotainment system, backup camera, dashboard warning lights, and the voice that tells you to buckle your seat... » read more

Advantages Of Picosecond Ultrasonic Technology For Advanced RF Metrology
By Onto Innovation - 06 Apr, 2021 - Comments: 0

This paper is from China Semiconductor Technology International Conference (CSTIC). Picosecond Ultrasonics (PULSE Technology) has been widely adopted as the tool-of-record for metal film thickness metrology in semiconductor fabs around the world. It provides unique advantages, such as being a rapid, non-contact, non-destructive technology, and has capabilities for simultaneous multiple layer... » read more

Finding And Fixing Design And Testbench Coding Errors On The Fly
By Synopsys - 06 Apr, 2021 - Comments: 0

Two things are certain in chip verification: as many bugs as possible must be found and fixed before fabrication, and this must happen as early as possible in the development process. The much-desired “shift left” in verification requires that advanced analysis and debug technologies be available to engineers from the earliest stages of the project. It is preferable that many classes of err... » read more

ATE In The Age Of Convergence And Exascale Computing
By Matthias Stahl - 06 Apr, 2021 - Comments: 0

We are currently in the midst of the age of convergence – that is, the convergence of data from a range of applications and data sources. These sources constitute anything that creates data – ranging from human-created data, such as voice and video, through automotive, mobile, and wireless/IoT devices. This also includes edge computing and servers storing the massive amounts of data needed ... » read more

Hunting For Open Defects In Advanced Packages
By Anne Meixner - 17 Mar, 2021 - Comments: 5

Catching all defects in chip packaging is becoming more difficult, requiring a mix of electrical tests, metrology screening, and various types of inspection. And the more critical the application for these chips, the greater the effort and the cost. Latent open defects continue to be the bane of test, quality, and reliability engineering. Open defects in packages occur at the chip-to-substra... » read more

Preventing Chips From Burning Up During Test
By Bryon Moyer - 09 Mar, 2021 - Comments: 1

It’s become increasingly difficult to manage the heat generated during IC test. Absent the proper mitigations, it’s easy to generate so much heat that probe cards and chips literally can burn up. As a result, implementing temperature-management techniques is becoming a critical part of IC testing. “We talk about systems, saying the system is good,” said Arun Krishnamoorthy, senior... » read more

Cloud Vs. On-Premise Analytics
By Anne Meixner - 09 Mar, 2021 - Comments: 2

The immense and growing volume of data generated in chip manufacturing is forcing chipmakers to rethink where to process and store that data. For fabs and OSATs, this decision is not one to be taken lightly. The proprietary nature of yield, performance, and other data, and corporate policies to retain tight control of that data, have so far limited outsourcing to the cloud. But as the amount... » read more

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