category: Test, Measurement and Analytics

category: Auto, Security & Edge AI

5G Brings New Testing Challenges
By Bryon Moyer - 11 Aug, 2020 - Comments: 0

As 5G nears commercial reality, makers of chips and systems that will support 5G will need to take on the standard burden of characterizing and testing their systems to ensure both performance and regulatory adherence. Millimeter-wave (mmWave) and beamforming capabilities present the biggest testing challenges. “5G is expected to have the extended coverage plus the bandwidth to harness ... » read more

Auto Chip Reliability Opens Door To Other Industries
By SE Staff - 11 Aug, 2020 - Comments: 1

Digital chips in the semiconductor industry evolve from each other. Ideas flow into each other over the years, with occasional big leaps in evolution. The term ‘evolution’ fits because one chip evolves to perfectly optimized for one industry niche. But what happens when one industry’s chip becomes a useful for other industries because it is more cost-effective than what is being used i... » read more

Considerations For 5G Production Test
By David Viera - 11 Aug, 2020 - Comments: 0

Like all technology advancements, bringing 5G to market requires an array of supporting tools to ensure the end products meet expectations. It will require significant performance advances in chip technology and manufacturing processes—all the while keeping price/performance at an economically viable level. Earlier this year, FormFactor’s Daniel Bock along with Jeff Damm outlined three c... » read more

In-field In-Mission Reliability Monitoring Based On Deep Data
By proteanTecs - 11 Aug, 2020 - Comments: 0

This paper describes a Deep Data approach to reliability monitoring in advanced electronics, based on degradation as a precursor for failure. By applying machine learning algorithms and analytics to data created by on-chip monitoring IPs (Agents), IC/system health and performance can be continuously monitored, at all stages of the product lifecycle. Realtime degradation analysis of critical par... » read more

Advanced Packaging, Heterogeneous Integration And Test
By FormFactor - 11 Aug, 2020 - Comments: 0

Major products rely on advanced packaging to reach the market; a groundswell of die-integration technologies are revolutionizing packaging, assembly, and test. At this exciting time in the industry, open engagement between customers and suppliers has never been more important for the test community. Click here to read more. » read more

Customer Input Guides Tool Development
By Marie Ryan - 11 Aug, 2020 - Comments: 0

We’re always looking for high-value items which add to our yield management software without over-complicating or detracting from the core functions. It is an interesting and highly responsible position to be able to take ideas and input from many people, look for common elements in problems and find solutions that can solve many problems. High-value functionality A great example of this ... » read more

Case Study – Socket Metrology
By CyberOptics - 11 Aug, 2020 - Comments: 0

From hours to seconds, the SQ3000 CMM optimized our customer’s backend inspection and socket metrology cutting cost and increasing yields for their high-volume manufacturing.Our customer was leveraging a Coordinate Measurement Machine (CMM) to handle the intricate measurements required for their socket metrology, semiconductor jigs and mobile phone sensors. Click here to continue reading. » read more

No Two Chips Are Alike
By Alex Burlak - 27 Jul, 2020 - Comments: 0

As semiconductor processes continue to shrink it’s becoming increasingly challenging to manage the parameters of individual devices not only across the diameter of the wafer, but also across the length of a single chip, especially for a complex chip with a large area. Today’s standard approach to this problem is to assume the worst case and to create a sub-optimal design that accommodates t... » read more

Navigating Timing Margins Like Waze
By Noam Brousard - 13 Jul, 2020 - Comments: 0

Remember the pre-smartphone days, before navigation apps had our backs? Thanks to a lack of real-time visibility, ‘arriving early’ was the go-to strategy to avoid arriving late. Factor in too much ‘holdup time’ and you’d arrive a little too early. There’s nothing worse than nervously burning off an excess 30 minutes over a coffee you really didn’t need. Today you wouldn’t ... » read more

Next Challenge: Known Good Systems
By Ed Sperling - 07 Jul, 2020 - Comments: 0

The leading edge of design is heading toward multi-die/multi-chiplet architectures, and an increasing number of mainstream designs likely will follow as processing moves closer to the edge. This doesn't mean every chipmaker will be designing leading-edge chips, of course. But more devices will have at least some leading-edge logic or will be connected over some advanced interconnect scheme t... » read more

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