category: System-Level Design

category: Auto, Security & Edge AI

Blog Review: June 7
By Jesse Allen - 07 Jun, 2023 - Comments: 0

Synopsys' Kenneth Larsen and Powerchip's S.Z. Chang explore wafer-on-wafer (WoW) and chip-on-wafer (CoW), 3D hybrid bonding schemes that can be used to stack memory on logic with shorter signal transmission distance at no wasted power and more interconnect and bandwidth density. In a podcast, Siemens' Conor Peick, Nand Kochhar, and Mark Sampson chat about how companies can address growing co... » read more

Week In Review: Design, Low Power
By Jesse Allen - 02 Jun, 2023 - Comments: 0

Arm debuted its latest platform for mobile computing. Arm Total Compute Solutions 2023 adds the new Immortalis-G720 GPU based on the 5th Generation GPU architecture, which redefines parts of the graphics pipeline to reduce memory bandwidth for the next generation of high geometry games and real-time 3D applications. The company also added two new Mali GPUs. In addition, Arm introduced a cluster... » read more

Blog Review: May 31
By Jesse Allen - 31 May, 2023 - Comments: 0

Cadence's Moshik Rubin looks at how the Portable Test and Stimulus Standard (PSS) is finding new use cases in ATE production test by enabling creation of a rich set of functional test scenarios in a reusable way. Synopsys' LJ Chen and Dana Neustadter check out the latest version of the Universal Flash Storage (UFS) standard, which doubles the data transfer rate of the preceding UFS 3.1 solut... » read more

Software-Defined Hardware Architectures
By Brian Bailey - 31 May, 2023 - Comments: 0

Hardware/software co-design has been a goal for several decades, but success has been limited. More recently, progress has been made in optimizing a processor as well as the addition of accelerators for a given software workload. While those two techniques can produce incredible gains, it is not enough. With increasing demands being placed on all types of processing, single-processor solutio... » read more

How Sub-THz Will Impact the Future Of 6G
By Alejandro Escobar Calderon - 30 May, 2023 - Comments: 0

By Alejandro Escobar Calderon and Gerardo Orozco The world is more connected than ever before and, while this notion isn’t new, many of us fail to fully grasp at times the magnitude of connection growth speed. As of 2022, the world had around 13.2B IoT connections (Ericsson Mobile) with a YoY growth of 13%. Additionally, mobile network data traffic has doubled every two years since 2019. T... » read more

Week In Review: Design, Low Power
By Karen Heyman - 26 May, 2023 - Comments: 0

Cadence bought Pulsic, a U.K.-based developer of place-and-route tools for custom digital and analog. The acquisition follows a previous acquisition attempt by a Chinese firm in August 2022, which was blocked by the U.K. government. At the G7 Summit in Japan, IBM announced a 10-year, $100 million initiative with the University of Tokyo and the University of Chicago to develop a quantum-centr... » read more

A Highly Wasteful Industry
By Brian Bailey - 25 May, 2023 - Comments: 1

The systems industry as a whole is not concerned about power. I know that is a bold statement, but I believe it to be true. The semiconductor industry is mildly concerned, but only indirectly. They care about power because thermal issues are limiting the functionality they can squeeze onto a chip, or in a package. Some users, such as data center operators, claim to care about power because i... » read more

Chiplet Planning Kicks Into High Gear
By Ann Mutschler - 25 May, 2023 - Comments: 0

Chiplets are beginning to impact chip design, even though they are not yet mainstream and no commercial marketplace exists for this kind of hardened IP. There are ongoing discussions about silicon lifecycle management, the best way to characterize and connect these devices, and how to deal with such issues as uneven aging and thermal mismatch. In addition, a big effort is underway to improve... » read more

Chip Design CEO Outlook
By Ed Sperling - 25 May, 2023 - Comments: 0

Semiconductor Engineering sat down with Joseph Sawicki, executive vice president for IC EDA at Siemens Digital Industries Software; John Kibarian, president and CEO of PDF Solutions; John Lee, general manager and vice president of Ansys' Semiconductor Business Unit; Niels Faché, vice president and general manager of PathWave Software Solutions at Keysight; Dean Drako, president and CEO of IC M... » read more

IP Becoming More Complex, More Costly
By Brian Bailey - 25 May, 2023 - Comments: 0

Success in the semiconductor intellectual property (IP) market requires more than a good bit of RTL. New advances mandate a complete design, implementation, and verification team, which limits the number of companies competing in this market. What constitutes an IP block has changed significantly since the concept was first introduced in the 1990s. What was initially just a piece of RTL (reg... » read more

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