tag: ADAS

Innovations In Sensor Technology
By John Koon - 09 Dec, 2021 - Comments: 0

Sensors are the “eyes” and “ears” of processors, co-processors, and computing modules. They come in all shapes, forms, and functions, and they are being deployed in a rapidly growing number of applications — from edge computing and IoT, to smart cities, smart manufacturing, hospitals, industrial, machine learning, and automotive. Each of these use cases relies on chips to capture d... » read more

Meeting Processor Performance And Safety Requirements For New ADAS & Autonomous Vehicle Systems
By Fergus Casey - 02 Dec, 2021 - Comments: 1

By Fergus Casey and Srini Krishnaswami Innovation in today’s automotive industry is accelerating as companies race to be the market leader in safety and autonomous vehicles. With vehicle control moving from humans to the vehicles’ active safety systems, more sensors – cameras, radar, lidar, etc. – are being added to automotive systems. More sensors require more computational performa... » read more

MIPI On Wheels: Enabling ADAS Applications
By Joseph Rodriguez - 11 Nov, 2021 - Comments: 0

Formed in 2003, the Mobile Industry Processor Interface (MIPI) Alliance brought together leading system and chip companies to provide standards for the essential video interface technologies for cameras and displays in phones. Over the years, the alliance has expanded its scope to publish specifications covering physical layer, multimedia, chip-to-chip and inter-processor communications (IPC), ... » read more

Optimizing System-Level Connectivity In Heterogenous Automotive Packages
By Keith Felton - 04 Nov, 2021 - Comments: 0

By Keith Felton and Cristina Somma With the massive growth of electronics in the automotive sector (such as autonomous driving, electric vehicles, and safety systems), the complexity, capabilities, and volume of semiconductors is rapidly increasing the demand for greater package connectivity density. This has led to high-end IC-package solutions, such as copper pillar bumping with very fi... » read more

Effect Of Environmental Factors On ADAS Sensor Performance (AAA)
By Technical Paper Link - 19 Oct, 2021 - Comments: 0

Abstract "Advanced driver assistance systems (ADAS) are becoming increasingly integrated within new vehicles sold in the United States. However, the majority of publicly available performance evaluations occur within idealized operation conditions in terms of weather, time of day, and sensor status, which are typically unrepresentative of naturalistic environments.  To evaluate the performa... » read more

Fan-Out And Packaging Challenges
By Mark LaPedus - 06 Oct, 2021 - Comments: 2

Semiconductor Engineering sat down to discuss various IC packaging technologies, wafer-level and panel-level approaches, and the need for new materials with William Chen, a fellow at ASE; Michael Kelly, vice president of advanced packaging development and integration at Amkor; Richard Otte, president and CEO of Promex, the parent company of QP Technologies; Michael Liu, senior director of globa... » read more

Long-Haul Trucking With Fewer Drivers
By Ann Mutschler - 13 Sep, 2021 - Comments: 1

The trucking industry is betting heavily on increasing levels of autonomy and electrification to reduce the cost of moving goods and to overcome persistent problems. The economics of autonomous driving are compelling, not least of which is an almost perpetual shortage of qualified drivers. But there also are a number of technical hurdles to making this work. On top of the challenges facing t... » read more

Consistent Test Reuse Across MIL, SIL, And HIL In A Model-Driven Development Workflow
By Siemens EDA - 01 Sep, 2021 - Comments: 0

This paper presents a standards-based, systematic, and automated generative MDD/XIL workflow that helps automotive developers develop their production ECU V&V suites early during software modeling and re-use them throughout the overall systems engineering project. The test cases developed during design can be re-used through to production ECU testing and ultimately for automated regression V&V ... » read more

Physics-Based Sensor Validation Via Ansys: Driving New Automotive Innovations
By Ansys - 13 Aug, 2021 - Comments: 0

Autonomous driving is revolutionizing the global automotive industry. With every new model, cars are smarter and more capable of independently responding to external signals like lane markings, highway signs, other cars and pedestrians. However, formulating a correct response via artificial intelligence depends on flawless sensor performance. With so many sensors supporting the advanced driv... » read more

Multi-Layer Deep Data Performance Monitoring And Optimization
By proteanTecs - 10 Aug, 2021 - Comments: 0

Combining functional and parametric monitoring of the real-world behavior of complex SoCs provides a powerful new approach that facilitates performance optimization during development and in the field, improves security and safety, and enables predictive maintenance to prevent field failures. proteanTecs’ Universal Chip Telemetry (UCT) and Siemens’ Tessent Embedded Analytics are complementa... » read more

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