tag: DSA

Optical Lithography, Take Two
By Mark LaPedus - 21 Feb, 2013 - Comments: 0

By Mark LaPedus It’s the worst-kept secret in the industry. Extreme ultraviolet (EUV) lithography has missed the initial stages of the 10nm logic and 1xnm NAND flash nodes. Chipmakers hope to insert EUV by the latter stages of 10nm or by 7nm, but vendors are not counting on EUV in the near term and are preparing their back-up plans. Barring a breakthrough with EUV or other technology, IC ... » read more

Experts At The Table: Issues In Lithography
By Ed Sperling - 05 Nov, 2012 - Comments: 0

By Mark LaPedus Semiconductor Manufacturing & Design sat down to discuss future lithography challenges with Juan Rey, senior director of engineering at Mentor Graphics; Aki Fujimura, chairman and chief executive at D2S; and Tatsuo Enami, general manager for the sales division at Gigaphoton. What follows are excerpts of that conversation. SMD: What is the general state of the next-genera... » read more

Experts At The Table: Issues In Lithography
By Ed Sperling - 18 Oct, 2012 - Comments: 0

By Mark LaPedus Semiconductor Manufacturing & Design sat down to discuss future lithography challenges with Juan Rey, senior director of engineering at Mentor Graphics; Aki Fujimura, chairman and chief executive at D2S; and Tatsuo Enami, general manager for the sales division at Gigaphoton. What follows are excerpts of that conversation. SMD: What are the big challenges in lithography?... » read more

DSA: High Stakes Game Of Alphabet Soup
By Ed Sperling - 20 Sep, 2012 - Comments: 0

By Mark LaPedus Directed self-assembly (DSA) is making progress for potential use in semiconductor production, but the industry must make some major advances in a sometimes forgotten and unsung segment—materials. DSA is a complementary patterning technology that makes use of block copolymer materials to enable fine pitches in chip designs. But today’s block copolymers based on poly (MMA... » read more

DSA Moves To R&D Pilot Lines
By Ed Sperling - 31 Jul, 2012 - Comments: 0

By Mark LaPedus Directed self-assembly (DSA), an alternative lithography technology that makes use of block copolymers, is still in the R&D stage for semiconductor production. But as the exotic patterning technology continues to make astounding progress, there are signs the IC industry is accelerating its efforts to bring DSA from the lab to the fab. In fact, DSA suddenly has become a ... » read more

More Design Rules Ahead
By Ed Sperling - 25 Jul, 2012 - Comments: 0

By Ed Sperling & Mark LaPedus For those companies that continue to push the limits of feature shrinkage, designs are about to become more difficult, far more expensive—and much more regulated. Two converging factors will force these changes. First, the limits of current 193nm immersion lithography mean companies now must double pattern at 20nm, and potentially quadruple pattern at 14n... » read more

Experts At The Table: Multipatterning
By Ed Sperling - 26 Jun, 2012 - Comments: 0

By Ed Sperling Semiconductor Manufacturing & Design sat down with Michael White, physical verification product line manager at Mentor Graphics; Luigi Capodieci, R&D fellow at GlobalFoundries; Lars Liebmann, IBM distinguished engineer; Rob Aitken, ARM fellow; Jean-Pierre Geronimi, CAD director at STMicroelectronics; and Kuang-Kuo Lin, director of foundry design enablement at Samsung Ele... » read more

The Ins And Outs Of Directed Self-Assembly
By Ed Sperling - 26 Jun, 2012 - Comments: 0

By Mark LaPedus H.S. Phillip Wong, professor of electrical engineering at Stanford University and one of the leading experts on directed self-assembly (DSA) technology, sat down to discuss the future of this approach with Semiconductor Manufacturing & Design. With funding from the Semiconductor Research Corp. (SRC), Stanford is exploring contact-hole patterning and the design infrastructur... » read more

Fallback Plans
By Ed Sperling - 26 Jun, 2012 - Comments: 0

By Ann Steffora Mutschler With EUV lithography missing a few deadlines already, the semiconductor industry has begun to search for alternatives. None of these solutions is simple, of course, and it’s questionable whether they’re even economically viable. And even if EUV is ready for mass production by 14nm, there are new challenges that have to be dealt with—particularly in the space... » read more

The Hidden Costs Of Directed Self-Assembly
By Ed Sperling - 29 May, 2012 - Comments: 2

By Mark LaPedus Directed self-assembly (DSA) has been billed by some as a potential paradigm shift in semiconductor manufacturing, but it may not turn out to be quite the panacea its proponents suggest—or at least not yet. There are many questions surrounding DSA, an alternative lithography technology that makes use of block copolymers to enable fine pitches. Key among those questions ar... » read more

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