Blog Review: April 1


A Russian plan to build a massive cargo plane to deliver tanks at supersonic speed—A roll of tape coated in squid proteins provides perfect camouflage—A yacht made of volcanic fibers battling the world's roughest seas: Ansys' Justin Nescott finds everything for a James Bond movie in this week's top tech articles. Writing for Synopsys, Broadcom's Hari Balisetty looks at reusable sequences... » read more

Week 42: Celebrating The 50th Anniversary Of Moore’s Law At DAC


April 19th will mark the 50th anniversary of Gordon Moore’s now famous paper in Electronics Magazine predicting that the number of transistors on a chip will double every year. In 1975, Moore—Intel’s co-founder—revised the period to every two years, and it is still holding true. Moore’s Law not only became a legendary prediction and long-term planning guide for the semiconductor indus... » read more

The Week In Review: Design/IoT


Tools Mentor Graphics uncorked its new IC, package, and PCB co-design and optimization product. It includes a formal flow for ball grid array ball-map planning and optimization based on an "intelligent pin" concept and a multi-mode connectivity management system for cross-domain pin-mapping and system level cross-domain logical verification. Synopsys released a new tool for designing ASIP... » read more

What Is Functional Accuracy?


What it means to be functionally accurate in the context of [getkc id="104" kc_name="virtual platforms"] varies greatly, depending upon whom you ask and even when you ask them. But that doesn’t mean that functional accuracy isn’t useful. Jon McDonald, technical marketing engineer for the design and creation business at [getentity id="22017" e_name="Mentor Graphics"], expects to see a lot... » read more

Patents And EDA Making Waves


If the old adage “may you live in interesting times” is true, then lawyers must be wondering if they should be very happy or scared. The rate at which [getkc id="16" comment="patent"] law, and patents in general, are changing should give everyone pause – including the future competitiveness of the United States and the value of patents to EDA. The World Intellectual Property Organizati... » read more

Chip-Package-Board Optimization: The Future Of Integrated Co-Design


Multi-die and three-dimensional packages have made breakout and routing of extremely high-pin-count devices on PCBs very difficult. Keeping track of all the signals and pins is also a task that has just about outgrown current methods. Many companies simply use a spreadsheet for tracking signals. With no central database or accurate device modeling and rule-based optimization, design intent is o... » read more

DDR4 Board Design And Signal Integrity Verification Challenges


This paper, originally presented at DesignCon and nominated for a best paper award, includes an investigation of DDR4's Pseudo Open Drain driver and what its use means for power consumption and Vref levels for the receivers. This paper also examines a DDR4 system design example and the need for simulating with IBIS power aware models versus transistor level models for Simultaneous Switching ... » read more

Blog Review: March 25


From brain implants that recover memories to color-shifting shoes, Ansys' Bill Vandermark features sci-fi visions of the future that are becoming reality in his top five tech picks of the week. In the world of embedded software, is a black box better? Mentor's Colin Walls questions whether the advantages that come of having full access to source code outweigh the downsides. Cadence's Neel... » read more

Week 41: The Rise Of Security At DAC


All potential attendees interested in security topics should know one thing—the Wednesday keynote on hacking automobiles, while sure to be compelling, will only scratch the surface of security-related content at DAC. Another presenter will talk about how increasing demand for “connected life on the go” and “Internet-enabled everything” opens up a wide variety of security issues for Io... » read more

The Week In Review: Design/IoT


Mergers & Acquisitions Silvaco acquired Invarian, anticipating integration of Invarian's methodology will accelerate adoption of concurrent power-voltage-thermal analysis. Legal A U.S. District Court judge ordered Kilopass to pay $5.5 million to Sidense for legal fees incurred in Kilopass' patent infringement suit against Sidense. That lawsuit was  dismissed in 2012. Sidense filed... » read more

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