category: Test, Measurement and Analytics

category: Auto, Security & Edge AI

Advanced Modeling In FTIR Offers New Applications For HVM
By Benoit Ravot - 09 Nov, 2021 - Comments: 0

In the leading high-volume manufacturing (HVM) process flows, materials-enabled scaling has increased inline applications for compositional metrology. A previous blog discussed how Fourier transform infrared (FTIR) spectroscopy was used for inline composition measurements. These measurements informed advanced process control for the wafer-level processing of selectively etched 3D NAND wordli... » read more

Novel Reversible Chain Diagnosis Improves Resolution
By Jayant D'Souza - 09 Nov, 2021 - Comments: 0

Yield ramp for ICs designed on advanced process technologies faces new challenges because of the very complicated silicon defect types and defect distribution. Yield ramp and yield improvement are not just about profitability and time-to-market, but also have a role in today’s electronics supply chain crisis. That means yield ramp affects not just the IC maker, but the global economy. Ever... » read more

Automotive Keyless Entry SoC Test Methodologies And Techniques
By Philip Brock - 09 Nov, 2021 - Comments: 0

By Philip Brock, Louis Benton, Jr., and Jonvyn Wongso Passive Entry Passive Start (PEPS) technology has become standard in the automotive market for keyless operation. A secure wireless communication system, PEPS enables you to lock and unlock the vehicle, and start and stop the vehicle without physically using the key. Electronic functionality embedded in the key fob to interact with the ve... » read more

Expanding Silicon Lifecycle Management To Real-Time System Performance Optimization
By Steve Pateras - 09 Nov, 2021 - Comments: 0

Semiconductor development is currently in one of its periodic crises, with many factors combining to require dramatically new technologies and methodologies. Chips continue to grow ever larger and more complex, with 3D IC devices adding another layer of challenges. Huge data centers, autonomous vehicles, and algorithms using artificial intelligence (AI) and machine learning (ML) drive a relentl... » read more

Industrial Radiography — CT Scanning for Metrology Applications
By CyberOptics - 09 Nov, 2021 - Comments: 0

Xray technology, more specifically computed tomography (CT), has been adapted for use as an instrument of industrial metrology. Early adopters have quickly recognized the benefits of internal and external nondestructive testing for 3D defect detection and geometric analysis, while those considering adoption may be uncertain how to implement the technology effectively. This study was conducted t... » read more

Imaging Of Overlay And Alignment Markers Under Opaque Layers Using Picosecond Laser Acoustic Measurements
By Onto Innovation - 09 Nov, 2021 - Comments: 0

Optically opaque materials present a series of challenges for alignment and overlay in the semi-damascene process flow or after the processing of the magnetic tunnel junction (MTJ) of a Magnetic Random-Access Memory (MRAM). The overlay and alignment of a lithographically defined pattern on top of the pattern and the underlying layer is fundamental to device operation in all multi-layer patterne... » read more

Strategies For Meeting Stringent Standards For Automotive ICs
By Prasad Bachiraju - 26 Oct, 2021 - Comments: 0

It may surprise you, but when it comes to chips in electronic braking systems, airbag control units, and more, automotive manufacturers are still using 10-year-old technology — and with good reason. For the automotive industry, the reliability, stability, and robustness of electronic components are critical, especially when it comes to meeting the stringent Automotive Electronics Council (... » read more

Total Critical Area For Optimizing Test Patterns
By Ed Sperling - 19 Oct, 2021 - Comments: 0

Increasing complexity at advanced nodes makes it much harder to locate defects and latent defects because there is more surface area to cover and much less space between the various components in a leading-edge chip design. Ron Press, technology enablement director at Siemens Digital Industries Software, talks about why it’s so important to predict where defects are most likely to occur in th... » read more

Manage Scaling Challenges For Silicon Success
By Siemens EDA - 12 Oct, 2021 - Comments: 0

Semiconductor companies are faced with significant challenges related to technology scaling, design scaling, and system scaling. These challenges have a broad impact on design development, manufacturing, and functional operation. This paper discusses the challenges and the specific impact of a Silicon Lifecycle Solutions approach that includes DFT, operations, and Embedded Analytics in enabling... » read more

Inspecting, Testing, And Measuring SiC
By Patrick Waurzyniak - 12 Oct, 2021 - Comments: 0

Achieving the auto industry's stringent zero defect goals is becoming a big challenge for makers of silicon carbide substrates, which are struggling to achieve sufficient yields and reliability as they migrate from 150mm to 200mm wafers and shift their focus away from pure silicon. SiC is a combination of silicon and harder carbide materials, and it has emerged as a key technology for batter... » read more

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