IEDM announcements, including 2nm and 2D materials advances from Intel and TSMC, CFETs, and subtractive ruthenium metallization; Rapidus’ new partnerships; Synopsys’ 1.6 Tbps Ethernet IP; Micron’s $6.1B DRAM fab grant; global IC sales set record; Lam’s maintenance cobot; China ramps U.S. imports ahead of tariffs.
The 2024 IEEE International Electron Devices Meeting (IEDM) was held this week, prompting a number of announcements from:
Rapidus announced new and updates to existing partnerships with:
Synopsys also unveiled its Ultra Ethernet IP, which can enable 1.6 Tb/s of bandwidth to up to 1 million endpoints. The company also announced its UALink IP solutions, which includes controllers, PHYs, and verification IP, with up to 200 Gbps throughput per lane.
IBM designed a process for co-packaged optics that uses polymer optical waveguides, enabling the addition of six times as many optical fibers at the edge of a silicon photonics chip compared to current CPO.
In U.S. government news:
SEMI reports that global sales of semiconductor manufacturing equipment by OEMs are set for a record $113 billion in 2024, growing 6.5% year over year. The organization anticipates the market will reach $121 billion in 2025 and $139 billion in 2026.
Lam Research introduced a collaborative robot (cobot) for the semiconductor industry that is designed to perform critical maintenance tasks on wafer fabrication equipment repeatability with sub-micron precision. It currently supports Lam’s dielectric etch tools and will expand to additional tools.
Fig. 1: A collaborative robot. Source: Lam Research
Special Report: Automotive chips are aging significantly faster than expected in hot climates with sustained high temperatures, raising concerns about the reliability of electrified vehicles over time and whether advanced-node chips are the right choice for safety-critical applications.
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Semiconductor Engineering published its Test, Measurement & Analytics newsletter this week, featuring these top stories:
And its Low Power-High Performance newsletter featured these articles:
More reporting this week:
China is ramping up imports of U.S. chips ahead of new trade restrictions, importing 14.8% more ICs (501.5 billion) from January to November than it did in the same period last year, reported SCMP. And China’s top design tool maker Empyrean Technology is handing control of its board to a state-owned enterprise after U.S. blacklisting.
TSMC issued its November 2024 revenue report, reflecting a 12% decrease from the prior month, but a 34% increase from November 2023.
IC design services firm Microip went public on Taiwan’s Emerging Stock Market.
CSIS published a report, “Silicon Surrender: How Ending Russian Electronics Imports Supports Negotiations,” and Bloomberg reported on how Russia’s military is buying U.S. chips. Meanwhile, Russia partnered with BRICS countries (Brazil, Russia, India, China, and South Africa) to create an AI alliance.
ITIF reported on why tariffs won’t save U.S. semiconductor manufacturing.
UMC’s collaboration with suppliers to build a sustainable supply chain contributed to 2.64 million tons of carbon reduction.
Acquisition news:
Recent fundings:
New market reports:
Advantest launched an integrated known-good-die test cell designed to maximize die-level test yields for wide-bandgap devices used in power semiconductors.
Synaptics extended its Veros IoT connectivity family with a dual-core Bluetooth 5.4 and IEEE 802.15.4 system on chip. The Matter-compliant SoC supports Bluetooth Classic, Bluetooth Low Energy, Zigbee, and Thread protocols concurrently on both cores.
Rambus extended its patent license agreement with Micron Technology for five years. Details of the agreement are confidential, but the deal allows Micron broad access to Rambus’ patent portfolio until late 2029.
Keysight joined the Intel Foundry Accelerator United States Military, Aerospace and Government Alliance. Keysight already provides EDA tools to the defense industry, a role that will be expanded by their membership in the alliance.
Siemens:
Alpha and Omega Semiconductor released a 4-phase controller for Blackwell GPUs designed to minimize ripple effects, which allows the device to achieve a slew rate of up to 30mV/us.
Marvell revealed a new HBM compute architecture for XPUs. The custom architecture can achieve a 70% reduction in interface power by speeding up I/O interfaces between the internal AI accelerator and HBM base dies.
Broadcom combined 3D silicon stacking and 2.5D packaging technology for its new system-in-package platform that integrates more than 6,000 mm2 of silicon and up to 12 HBM stacks in one packaged device. The company deployed it in a new AI accelerator.
Samsung announced its new Android XR platform for headsets and glasses. Created with Qualcomm and Google, it leverages the Gemini AI model to create a conversational user interface and a contextual understanding of the world.
Recent security research:
The U.S. Department of the Treasury sanctioned China-based cybersecurity company Sichuan Silence and an employee for their roles in the April 2020 compromise of firewalls worldwide.
Two U.S. senators requested an investigation into the Department of Defense’s failure to secure its unclassified telephone communications from foreign espionage followingdd recent Chinese hacks.
The CWE REST API was updated to Version 4.16, offering an easy and way to stay up to date with vulnerabilities.
CISPA and the Technical University of Munich partnered to jointly research issues in cybersecurity and trustworthy AI.
The Cybersecurity and Infrastructure Security Agency (CISA) issued a number of alerts/advisories.
Pennsylvania State University will receive $3 million from DARPA as part of a larger grant awarded to Northrop Grumman, aiming to jointly develop a way to integrate gallium nitride (GaN) with silicon substrates.
The Michigan Strategic Fund board approved about $100 million for a supercomputing lab at the University of Michigan and another $28 million for Detroit Diesel to expand its EV parts manufacturing operation, per the Detroit News.
UC Davis joined the $285 million SMART USA Institute, a national initiative to advance research in semiconductor manufacturing.
Quobly demonstrated key building blocks for a quantum computer leveraging commercial FD-SOI.
Infleqtion demonstrated a materials science application powered by logical qubits. The experiment, which involved researchers from the Universities of Chicago and Wisconsin, used the NVIDIA CUDA-Q platform to achieve a 6x boost in application-level computational accuracy.
Infineon plans to retrospectively implement product compliance for the TRAVEO T2G automotive MCU family with the latest auto cybersecurity standard ISO/SAE 21434.
ROHM and TSMC are working together to develop and produce GaN power devices for EVs.
Hyundai and BAIC plan to inject $1.1 billion into their China JV to help speed up the EV transition.
Stellantis and CATL to invest up to €4.1 billion in a JV to build an all-new lithium iron phosphate (LFP) battery plant at Stellantis’ site in Zaragoza, Spain.
Factorial announced its first Solstice all-solid-state battery cells, developed with Mercedes, have been scaled to achieve a 40Ah capacity.
EV batteries subject to the normal use of real-world drivers could last about a third longer than researchers generally predict, according to a SLAC-Stanford Battery Center study.
China accounted for 61% of the global EV traction inverter installation volume in Q3 2024, reports TrendForce.
Synopsys is collaborating with the University of Moratuwa in Sri Lanka to develop semiconductor talent through the Synopsys Academic & Research Alliance (SARA) program.
Samsung Semiconductor India Research, IIIT-Bangalore, and VLSI System Design launched a Chip Design for High School program.
Find upcoming chip industry events here, including:
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SPIE Photonics WEst | Jan 25 – 30 | San Francisco |
DesignCon 2025 | Jan 28 – 30 | Santa Clara, CA |
Find all events here. | ||
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