Rethinking The Cloud


Data center architectures have seen very few radical changes since the commercial introduction of the [getentity id="22306" comment="IBM"] System/360 mainframe in 1964. There have been incremental improvements in speed and throughput over the years, with a move to a client/server model in the 1990s, but from a high level this is still an environment where data is processed and stored centrally ... » read more

Veloce System-Level Power Analysis And Verification


Power analysis and verification need to move to the system level, improving upon and extending the capabilities and scope of RTL and gate-level techniques. The performance, capacity, and flexibility of emulation platforms make them the ideal technology for system-level power analysis and verification. Veloce delivers unprecedented power verification and analysis capabilities. This paper shares ... » read more

Blog Review: March 11


How are sensors like a scallop's eyes? Rambus' Patrick Gill guides you through day in the life of the mollusk to show how inspiration for IoT was found in the sea. Cadence's Dimitry Pavlovsky discusses some of the intricacies associated with creating VIP for processor interconnect systems such as CHI, and how other tools are necessary to complete the task. Following Google's warning of a ... » read more

The Week In Review: Design/IoT


Mergers & Acqusitions Mentor Graphics acquired Tanner EDA, bolstering their position in tools for analog, mixed-signal and MEMs. Terms of the deal were not disclosed. NXP joins forces with Freescale. The merger carries a $16.7 billion price tag and potentially creates a new leader in the automotive and MCU markets. Standards Accellera sent UVM 1.2 off to the IEEE P1800.2 working... » read more

AUTOSAR And FlexRay


This paper describes ways tools are quickly becoming the foundation for optimization processes that help engineers design profitable automotive products more efficiently than ever before. Standards are the enabling platform for the modern computer-based design tools that have transformed industries around the world. AUTOSAR is a leading effort to bring some standardization to the software platf... » read more

Blog Review: March 4


Is gate-level simulation still necessary? Mentor's Gordon Allan asserts it is, and gives a list of reasons why the pain is worth the peace of mind. Synopsys' Aron Pratt concludes his series on parameterization strategies with a process that allows the testbench to make use of parameterized interfaces without imposing limits on VIP access. Should you use EUV or quadruple patterning for 7nm... » read more

Week 38: Finishing The DAC Program


The DAC executive committee convened last week for a two-day meeting to finalize the technical program. We call this the Wintermeeting, which by tradition is usually held at a destination chosen by the general chair. This year it was my turn and I selected a dude ranch in Wickenburg, Arizona. While the meeting serves the purpose of locking down all the final details for the conference program, ... » read more

The Week In Review: Design/IoT


Mergers & Acquisitions NXP acquired Quintic’s Bluetooth Low Energy and Wearable businesses, adding BLTE to their low power RF-connectivity portfolio. The team of approximately 65 is expected to join NXP when the deal closes in Q1 2015. Tools Cadence unveiled the integration of Forte's Cynthesizer with their own C-to-Silicon Compiler. The result is the Stratus high-level synthesis... » read more

Mentor Graphics Buys Tanner EDA


By Ed Sperling & Brian Bailey [getentity id="22017" e_name="Mentor Graphics"] has just purchased [getentity id="22561" e_name="Tanner EDA"] for an undisclosed sum, according to sources close to the deal. The acquisition moves Mentor squarely into the analog and mixed signal tools world, while positioning it to play a much bigger role in the Internet of Things market. Mentor isn't t... » read more

Partition Lines Growing Fuzzy


For as long as most semiconductor engineers can remember, chips with discrete functions started out on a printed circuit board, progressed into chip sets when it made sense and eventually were integrated onto the same die. The primary motivations behind this trend were performance and cost—shorter distance, fewer mask layers, less silicon. But this equation has been changing over the past ... » read more

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