category: System-Level Design

category: Auto, Security & Edge AI

Mechanical Challenges Rise With Heterogeneous Integration
By Ed Sperling - 03 Apr, 2023 - Comments: 0

Companies integrating multiple chips or chiplets into a package will need to address structural and other mechanical engineering issues, but gaps in the design tools, new materials and interconnect technologies, and a shortage of expertise are making it difficult to address those issues. Throughout most of the history of the semiconductors, few people outside of foundries worried about struc... » read more

Squeezing The Margins
By Barry Pangrle - 29 Mar, 2023 - Comments: 0

Back in 2016, we looked at the MediaTek Helio X20, the first Tri-Gear mobile SoC. Tri-Gear is a step beyond ARM’s big.LITTLE concept of using two different cores that have unique power and performance characteristics, by adding a third core. The main advantage to this approach is having more core choices to best run workloads at better energy efficiency and performance operating points. At... » read more

Blog Review: March 29
By Jesse Allen - 29 Mar, 2023 - Comments: 0

Siemens' Heather George suggests adopting a shift-left strategy for complex designs that integrate multiple dies into a package and examines the challenges and opportunities for performing comprehensive tests on 2.5D and 3D IC designs. Synopsys' Shekhar Kapoor notes that when considering whether a system will perform as intended, techniques that work well for monolithic SoCs may not be as we... » read more

RISC-V Disrupting EDA
By Brian Bailey - 23 Mar, 2023 - Comments: 3

The electronic design automation (EDA) industry started in the 1980s and primarily was driven by the test and PCB industries. The test industry was focused on simulation so that test vector sets could be developed and optimized. The PCB industry needed help managing complexity as system sizes grew. That complexity soon was eclipsed by IC complexity and the costs associated with making a mist... » read more

True 3D Is Much Tougher Than 2.5D
By Brian Bailey - 23 Mar, 2023 - Comments: 0

Creating real 3D designs is proving to be much more complex and difficult than 2.5D, requiring significant innovation in both technology and tools. While there has been much discussion about 3D designs, there are multiple interpretations about what 3D entails. This is more than just semantics, however, because each packaging option requires different design approaches and technologies. And a... » read more

Looking Beyond TOPS/W: How To Really Compare NPU Performance
By Paul Karazuba - 23 Mar, 2023 - Comments: 0

There is a lot more to understanding the true capabilities of an AI engine beyond TOPS per watt. A rather arbitrary measure of the number of operations of an engine per unit of power, the TOPS/W metric completely misses the point that a single operation on one engine may accomplish more useful work than a multitude of operations on another engine. In any case, TOPS/W is by no means the only spe... » read more

The Race Toward Mixed-Foundry Chiplets
By Ann Mutschler - 23 Mar, 2023 - Comments: 1

Creating chiplets with as much flexibility as possible has captured the imagination of the semiconductor ecosystem, but how heterogeneous integration of chiplets from different foundries will play out remains unclear. Many companies in the semiconductor ecosystem are still figuring out how they will fit into this heterogeneous chiplet world and what issues they will need to solve. While near... » read more

Rethinking Validation To Improve Products Quicker
By Kaitlynn Mazzarella - 23 Mar, 2023 - Comments: 0

By Kaitlynn Mazzarella and Marvin Landrum The boundaries of measurement science are being pushed more than ever before. Keeping up with evolving industry needs is not a simple feat. Not only does each new technology create business opportunities for companies to take share in new markets, but it also changes the way we design and test products. As the pace of technical innovation accelerates... » read more

How AI Drives Faster Verification Coverage And Debug For First-Time-Right Silicon
By Taruna Reddy - 23 Mar, 2023 - Comments: 0

By Taruna Reddy and Robert Ruiz These days, the question is less about what AI can do and more about what it can’t do. From talk-of-the-town chatbots like ChatGPT to self-driving cars, AI is becoming pervasive in our everyday lives. Even industries where it was perhaps an unlikely fit, like chip design, are benefiting from greater intelligence. What if one of the most laborious, time-co... » read more

System-on-Chip Design In The Cloud: One Size Does Not Fit All
By Nebabie Kebebew - 23 Mar, 2023 - Comments: 0

At an increasing pace, companies in the semiconductor ecosystem have started seriously considering the cloud for computing and storage. Some have migrated, and others are evaluating the cloud technology choices and are sizing the business impact and benefits to make the leap. Through key adoption reports, the cloud environment is proving to be beneficial for System-on-Chip (SoC) designers by pr... » read more

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