Chip Industry Technical Paper Roundup: Mar. 9

GPU for FHE; heterogeneous memory design; formal verification; oxide semiconductors for memory; edge agent deployments; RPU; AI hardware roadmap; in-memory computing accelerators.

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New technical papers recently added to Semiconductor Engineering’s library:

Technical Paper Research Organizations
FHECore: Rethinking GPU Microarchitecture for Fully Homomorphic Encryption
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Boston University, Northeastern University, KAIST, University of Murcia
Heterogeneous Memory Design Exploration for AI Accelerators with a Gain Cell Memory Compiler
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Stanford University, UCSC
Linear Formal Verification of Sequential Circuits using Weighted-AIGs
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University of Bremen
Oxide Semiconductor Gain Cell-Embedded Memory: Materials and Integration Strategies for Next Generation On-Chip Memory
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Seoul National University, KAIST
Systems-Level Attack Surface of Edge Agent Deployments on IoT
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Imperial College London
RPU — A Reasoning Processing Unit
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Harvard University
AI+HW 2035: Shaping the Next Decade
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UIUC, UCLA, Stanford University
Joint Hardware-Workload Co-Optimization for In-Memory Computing Accelerators
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KAUST, Compumacy

Find more semiconductor research papers here.



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