Analog plus 3D optics for AI inference; neuromorphic memristor; branch privilege injection; IC packaging metrology and material needs; automotive digital twins; thermal vulnerability of 3D-stacked HBM; optimizing LLMs under GPU memory constraints.
New technical papers recently added to Semiconductor Engineering’s library:
| Technical Paper | Research Organizations |
|---|---|
| Analog optical computer for AI inference and combinatorial optimization | Microsoft Research, Barclays, University of Cambridge |
| An Ultra-Robust Memristor Based on Vertically Aligned Nanocomposite with Highly Defective Vertical Channels for Neuromorphic Computing | Purdue University, UT Arlington |
| Branch Privilege Injection: Compromising Spectre v2 Hardware Mitigations by Exploiting Branch Predictor Race Conditions | ETH Zurich |
| Material Needs and Measurement Challenges for Advanced Semiconductor Packaging: Understanding the Soft Side of Science | NIST, NC State University, NREL, ASE, Intel, Innocentrix, Binghamton University |
| Engineering Automotive Digital Twins on Standardized Architectures: A Case Study | McMaster University |
| On the Thermal Vulnerability of 3D-Stacked High-Bandwidth Memory Architectures | NC A&T State University, New Mexico State University |
| MLP-Offload: Multi-Level, Multi-Path Offloading for LLM Pre-training to Break the GPU Memory Wall | Argonne National Laboratory, Rochester Institute of Technology |
Find more semiconductor research papers here.
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