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Acronyms

Commonly and not-so-commonly used acronyms.
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The following is a list of acronyms and what they stand for:

ACK – Acknowledge
ADC – Analog to Digital Converter
AI – Artificial Intelligence
ALD – Atomic Layer Deposition
ALE – Atomic Layer Etch
AMOLED – Active-Matrix OLED
AMP – Asymmetric Multi Processing
AOI – Automated Optical Inspection
AP – Access Point
ASIC – Application Specific Integrated Circuit
ATE – Automatic Test Equipment
BEOL – Back-End-Of-Line
BGA – Ball Grid Array
BSA – Basic Service Area
BTI – Bias-Temperature Instability
CA – Collision Avoidance
CBRAM – Conductive Bridging RAM
CCI – Cache Coherent Interconnect
CD Collision Detection
CF – Contention-Free
CFP – Contention-Free Period
CP – Contention Period
CPU – Central Processing Unit
CRC – Cyclic Redundancy Check
CSMA – Carrier Sense, Multiple Access
CFD – Computational Fluid Dynamic
CMOS – Complementary Metal Oxide Semiconductor
CNN – Convolutional Neural Network
CPP – Contacted Poly Pitch
CSP – Chip Scale Packaging
CTS – Clear To Send
DAC – Digital to Analog Convertor
DARPA – Defense Advanced Research Projects Agency
DCF – Distributed Coordination Function
DDR – Double Data Rate
DFA – Differential Fault Analysis
DFT – Design for Test
DFM – Design for Manufacturing
DIFS – Distributed Inter-frame Space
DPA – Differential Power Analysis
DL – Deep Learning
DRAM – Dynamic Random Access Memory
DRC – Design Rule Checker
DSA – Directed Self Assembly
DSP – Digital Signal Processor
DUT – Design Under Test
DUV – Design Under Verification
DVFS – Dynamic Voltage and Frequency Scaling
ECO – Engineering Change Order
EDA – Electronic Design Automation
EM – Electromagnetic
EM – Electromigration
ESL – Electronic System Level
EUV – Extreme Ultraviolet
FD-SOI – Fully Depleted Silicon on Insulator
FEOL – Front-End-Of-Line
FET – Field Effect Transistor
FIFO – First In First Out
FPGA – Field Programmable Gate Array
GAA – Gate-All-Around
GaAs – Gallium Arsenide
GaN – Gallium Nitride
GPU – Graphics Processing Unit
HBM – High Bandwidth Memory
HBT – Heterojunction Bipolar Transistor
HDL – Hardware Description Language
HMC – Hybrid Memory Cube
IC – Integrated Circuit
IEEE – Institute of Electrical and Electronics Engineers
IIC – Industrial Internet Consortium
IIoT – Industrial Internet of Things
IoT – Internet of Things
IP – Intellectual Property
IR – Infra-red
ISM – Industrial, Scientific, Medical
ISS – Instruction Set Simulator
ILT – Inverse Lithography Technology
JTAG – Joint Test Action Group
LAN – Local Area Network
LCD – Liquid Crystal Display
LTE – Long-Term Evolution
MAC -Media Access Control
MCU – Microcontroller
MEMS – Micro Electrical Mechanical Systems
MES – Manufacturing Execution Systems
ML-Machine Learning
MOL – Middle-Of-Line
MRAM – Magnetic Random Access Memory
NA – Numerical Aperture
NGL – Next-Generation Lithography
NIC – Network Interface Card
NSF – National Science Foundation
NVM – Non-Volatile Memory
OCAP – Out of Control Action Plan
OLED – Organic Light-Emitting Diode
OPC – Optical Proximity Correction
OS – Operating System
OSAT – Outsourced Semiconductor Assembly and Test
OTP – One Time Programmable
PCB – Printed Circuit Board
PCF – Point Coordination Function
PCM – Phase-Change Memory
PDK – Process Design Kit
PDN – Power Delivery Network
PHY – Physical Layer
PI – Power Integrity
PIFS – Point Inter-frame Space
PnR – Place and Route
PoP – Package-on-Package
PPA – Power, Performance, Area
PPAC – Power, Performance, Area, Cost
PRNG – Pure Random Number Generator
PVT – Process, Voltage, Temperature
RAM – Random Access Memory
RC4 – Rivest Cipher 4
RDL – Register Definition Language
RDL – Redistribution Layer
RF – Radio Frequency
ROM – Read Only Memory
RoT – Root Of Trust
RTL – Register Transfer Level
RTOS – Real Time Operating System
RTS – Request To Send
SCM – Storage Class Memory
SerDes – Serializer / Deserializer
SIFS – Short Inter-frame Space
SI – Signal Integrity
SiC – Silicon Carbide
SiGe – Silicon Germanium
SK – Shared Key
SMP – Symmetric Multi Processing
SoC – System on Chip
SOI – Silicon on Insulator
SPA – Simple Power Analysis
SRAF – Sub-Resolution Assist Features
SRAM – Static Random Access Memory
SSD – Solid-state Storage Drives
SSID – Service Set Identifier
STA – Static Timing Analysis
STI – Shallow Trench Isolation
TLM – Transaction Level Model
TSV – Through Silicon Via
UPF – Unified Power Format
USB – Universal Serial Bus
UVM – Universal Verification Methodology
VHDL – VHSIC Hardware Description Language
VHSIC – Very High Speed Integrated Circuit
VSLI – Very Large Scale Integration
VIP – Verification Intellectual Property
VoWi-Fi – Voice over Wi-Fi
Vt – theshold Voltage
Wan – Wide Area Network
WEP – Wired Equivalency Protocol
Wi-Fi – Wireless High Fidelity
WiGIG – Gigabit Wi-Fi
WLAN – Wireless Local Area Network
WLP – Wafer Level Packaging
WPA – Wi-Fi Protected Access