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2.5D

Multiple chips arranged in a planar or stacked configuration with an interposer for communication.
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Description

2.5D is a packaging methodology for including multiple die inside the same package

The approach typically has been used for applications where performance and low power are critical. Communication between chips is accomplished using either a silicon or organic interposer, typically a chip or layer with through-silicon vias for communication. While communication between chips is slower than on-chip communication, distances are shorter and there are more conduits for signals. The result is that collectively communication is faster and it requires less energy to drive those signals. In addition, distances can be shorter between chips than within a single planar die, and at advanced nodes, skinny wires in single-chip architectures can slow performance and increase resistance and capacitance.

2.5D architectures have been paired with stacked memory modules, particularly high-bandwidth memory, to further improve performance. The downside of this approach is that the interposers are expensive, and IP needs to be developed specifically for this architecture.


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