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Fan-Outs

A way of including more features that normally would be on a printed circuit board inside a package.
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Description

Fan-outs fit somewhere between system-in-packaging approaches and printed circuit boards. They are a way of extending what is inside a package by including more elements of what normally resides on a PCB.

The approach began taking hold after 2010 as a baby-step toward 2.5D and 3D-ICs. While not nearly as fast or power-efficient as a stacked die, it does allow components to be pre-integrated and tested to improve time to market as well as to incorporate some value-added approaches, such as thicker wires and better memory placement to improve overall performance, reduce RC delay and improve energy efficiency.


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