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High-Density Advanced Packaging (HDAP)

An umbrella term (circa 2015) for advanced packaging in semiconductors.
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Description

High-density advanced packaging (HDAP) is an umbrella term (circa 2015) for advanced packaging that increases functional density, higher performance, lower power, smaller PCB footprints, and thinner profiles. Examples of HDAP are 3D-IC, fan-out wafer-level packaging (FOWLP), and system-in-package, interposer-based packages (2.5D), CoWoS, high pin-count flip chip, and Wafer-on-Wafer.

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Total Overlay With Multiple RDLs

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Challenges Of Testing Advanced Packages